Skip to content
New issue

Have a question about this project? Sign up for a free GitHub account to open an issue and contact its maintainers and the community.

By clicking “Sign up for GitHub”, you agree to our terms of service and privacy statement. We’ll occasionally send you account related emails.

Already on GitHub? Sign in to your account

DOE, National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D), Request for Application, Due: Dec 20, 2024 #9

Open
opencode4good opened this issue Nov 4, 2024 · 0 comments

Comments

@opencode4good
Copy link
Collaborator

DOE, National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D), Request for Application

  • Posted: Oct 18, 2024
  • Deadline: Dec 20, 2024
  • Funding Institution: U.S. Department of Energy, National Institute of Standards and Technology (NIST)
  • Description: Applications such as high performance computing and low-power electronics, both needed for artificial intelligence (AI), require leap-ahead advances in semiconductor advanced packaging. This Notice of Funding Opportunity (NOFO) seeks proposals for R&D activities that will establish and accelerate domestic semiconductor advanced packaging through investments in five (5) R&D Areas: (1) Equipment, Tools, Processes, and Process Integration; (2) Power Delivery and Thermal Management; (3) Connector Technology, including Photonics and Radio Frequency (RF); (4) Chiplets Ecosystem; and (5) Co-design/Electronic Design Automation (EDA).
  • Link: https://www.grants.gov/search-results-detail/356762
Sign up for free to join this conversation on GitHub. Already have an account? Sign in to comment