You signed in with another tab or window. Reload to refresh your session.You signed out in another tab or window. Reload to refresh your session.You switched accounts on another tab or window. Reload to refresh your session.Dismiss alert
DOE, National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D), Request for Application, Due: Dec 20, 2024
#9
Open
opencode4good opened this issue
Nov 4, 2024
· 0 comments
DOE, National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D), Request for Application
Posted: Oct 18, 2024
Deadline: Dec 20, 2024
Funding Institution: U.S. Department of Energy, National Institute of Standards and Technology (NIST)
Description: Applications such as high performance computing and low-power electronics, both needed for artificial intelligence (AI), require leap-ahead advances in semiconductor advanced packaging. This Notice of Funding Opportunity (NOFO) seeks proposals for R&D activities that will establish and accelerate domestic semiconductor advanced packaging through investments in five (5) R&D Areas: (1) Equipment, Tools, Processes, and Process Integration; (2) Power Delivery and Thermal Management; (3) Connector Technology, including Photonics and Radio Frequency (RF); (4) Chiplets Ecosystem; and (5) Co-design/Electronic Design Automation (EDA).
DOE, National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D), Request for Application
The text was updated successfully, but these errors were encountered: